Solar Cell Interconnection Flux Pen

Description

• Pen applicator eliminates the mess of flux bottles
• Stops waste while limiting operator exposure to soldering chemicals
• Chisel point, spring loaded tip allows a controlled application by dispensing just the right amount of flux in a desired location
• QPL approved as Type RMA under MIL-F-14256
• Fluxing ability approaches that of Type RA flux
• Flux residue after soldering is non-corrosive and non-conductive
• Developed for use in critical applications where difficult assemblies are to be soldered, but process requirements stipulate use of Type RMA flux
• High thermal stability for soldering multi-layer assemblies which require a high preheat temperature
• Exposure to high preheat temperatures does not degrade solubility of residue in normal cleaning solvents
• No degradation of surface insulation resistance caused by the flux residue
• Minimal use of ionic activating agents and the inactive nature of the residue permits leaving the residue on circuit board assemblies for many applications
• Flux residue is moisture and fungus resistant
• Percentage of Solids (typical): 36%
• Container Size: .33 Oz (10ml) Pen